CUTTING PLATE AND CHIP REMOVAL DEVICE THEREFOR Russian patent published in 2019 - IPC B23B27/22

Abstract RU 2709128 C2

FIELD: turning; drilling.

SUBSTANCE: cutting plate (20) has at least first and second side surfaces (26A, 26B) and chip removal device (60), which includes at least one projection (20, 128) located along the cutting plate vertex (44A) bisector. When the chip removal device includes two projections (28, 128, 30, 130), they can be located symmetrically on both sides of the bisector. Each of at least one projections is elongated and extends longitudinally along an associated side surface.

EFFECT: higher efficiency of chip removal.

12 cl, 9 dwg

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RU 2 709 128 C2

Authors

Krishtul, Roman

Dates

2019-12-16—Published

2012-08-30—Filed