FIELD: physics.
SUBSTANCE: invention relates to machine and method of laser processing of profiles (P), in particular, for performance of inclined cutting operation on profile (P), for example, for creation of expanding hole (H). Before the processing operation, support-guiding device (12) is placed in the specified initial position along the longitudinal axis (x) of the profile (P) in relation to working head (10). During the processing operation, support-guiding device (12) is moved along the longitudinal axis (x) as an integral part with feed device (14) and, therefore, as an integral part with the profile (P), ensuring constant removal of the processed profile section (P) from support-guiding device. Said integral displacement of support-guide device (12) with feed device (14) does not extend to movement of feed device required to compensate for inclined motions of working head (10) around said oscillation axis (t).
EFFECT: technical result is expansion of functional capabilities.
4 cl, 5 dwg
