FIELD: chemistry.
SUBSTANCE: invention relates to chemical industry, specifically to mixtures for preparation of adhesive filling materials, which can be used for gluing and sealing holes and cavities in building structures from unplasticized polyvinyl chloride. Vinyl-containing mixture for preparation of adhesive filling material contains epoxy-diane uncured resin, filler, polyethylene polyamine and polyvinyl chloride. As filler vermiculite is used which is sifted through sieve No.5. Perchlorovinyl resin is also introduced in acetone with a resin concentration of 20 wt. %, and polyvinyl chloride is added by crushed and sieved through sieve No.2.5. Composition contains components in following ratio, wt. %: epoxy resin 31.4–39.83; polyethylene polyamine 5.1–6.02; vermiculite 43.06–51.74; perchlorovinyl resin in acetone 6.78–8.14; polyvinyl chloride 0.02–1.24.
EFFECT: invention increases strength and rigidity of the filling material, improves adhesion and enables its hardening without thermal exposure at room temperature.
1 cl, 2 tbl
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Authors
Dates
2020-09-07—Published
2019-12-27—Filed