DEVICE FOR ASSEMBLING AND SOLDERING LASER DIODE MATRIX Russian patent published in 2021 - IPC H01L21/58 H01L21/00 H01S5/32 

FIELD: semiconductor devices.

SUBSTANCE: invention relates to devices specifically designed for the manufacture or processing of semiconductor devices or devices on a solid body or parts thereof, namely, to fastening a semiconductor device on a support for assembling and soldering laser diode arrays. The device for assembling and soldering a matrix of laser diodes (MLD)) includes a base 1, in which a groove of a stepped profile 2 is formed for the installation of submodules 3 MLD, consisting of lines of laser diodes 4 (LLD) and heat sinks, a limiter 5, to which the first submodule is installed close 3 (Fig. 1), a support 6, made with an inclined working surface (angle α), on which the base 1 is installed, the clamping element 7 located in the groove of the stepped profile 2, the nut 8 ensures the movement of the clamping element 7 towards the limiter 5, over submodules 3 MLD, on which a single dielectric base 9 MLD is pre-installed, a fixing element 10 is installed, which is fixed using fastening elements 11. Special grooves 13 are made in the fixing element 10 for electrical leads 12 MLD in the fixing element 10.

EFFECT: ensuring reliable fixation of laser diode array submodules during their assembly and further soldering in the device.

3 cl, 2 dwg