FIELD: semiconductor lasers and radiators built around laser diodes for pumping high-power solid-state lasers. SUBSTANCE: module has laser diode strip and heat-transfer strip attached to the latter on active layer side; it incorporates built-in microchannel heat exchanger formed by shaped depression which is, essentially, range of equidistant straight parallel channels of similar rectangular section perpendicular to laser diode strip axis and separated by equal-thickness ribs; it is made in heat-transfer strip surface within its contact with active layer and hermetically sealed by laser diode strip. With coolant pumped through this microchannel heat exchanger it comes in direct contact with active layer of laser diode strip that functions as one of walls of cavity thereby providing for direct heat transfer from active layer during radiation process. Module may be modified either by filling channels of microchannel heat exchanger with inserts of microporous penetrable material whose frame is made of heat-conducting material or by replacing channel lattice with microcapillary layer. Cooling circuit ensures control of augmented heat transfer while maintaining uniform temperature distribution in active layer surface thereby providing for high total power, density, and spatial uniformity of module radiant flux.. Module size is sufficient to use high density of packing when assembling laser diode arrays. EFFECT: facilitated manufacture due to automation of production process. 3 cl, 4 dwg
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Authors
Dates
2000-05-27—Published
1998-02-05—Filed