METHOD TO ASSEMBLE MICROELECTROMECHANICAL DEVICES Russian patent published in 2014 - IPC B81C3/00 H01L41/22 H03H3/00 

FIELD: electricity.

SUBSTANCE: method includes formation of volume current leads (VCL) on contact sites of a primary converter (PC) of crystalline type by the method of thermosonic microwelding with subsequent installation of the PC onto the board of the secondary converter of microelectromechanical devices and systems (MEMS). At the same time they previously perform high-temperature assembly of the PC made of a sensitive element SE and other functional elements of MEMS, which is carried out at temperature of not more than 500°C, afterwards to volume current leads made on contact sites of the PC, made of alternating metal layers Cr - Au with thickness of not more than 0.4 mcm, current leads are welded, in the form of a wire of gold by the method of contact welding. Then the PC produced in the specified manner is connected by the produced current leads in the form of a wire by the method of contact welding to contact sites of the secondary converter (SC) of MEMS.

EFFECT: increased reliability of functioning under conditions of high complex external impact.

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