FIELD: chemistry.
SUBSTANCE: invention relates to modifying epoxy resins used as a base for producing impregnating compositions, adhesives and lacquer coatings. Disclosed is an epoxy adhesive comprising epoxidiane resin, a polyamine curing agent polyethylene polyamine and as modifiers, hollow microgranules, which are microspheres with diameter of 50–80 mcm, filled with cyanoacrylate adhesive, which shell is formed by polymerized cyanoacrylate adhesive.
EFFECT: improved operational characteristics of epoxy adhesives, namely increased impact and vibration resistance and imparting self-healing properties when micro fractures and cracks appear, as well as wider range of epoxy adhesives and binders based thereon.
1 cl, 1 tbl
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Authors
Dates
2022-04-14—Published
2021-05-12—Filed