FIELD: material processing.
SUBSTANCE: group of inventions relates to material processing by grinding and polishing; it can be used for elimination of defects in surface coating of a part. A method for grinding and/or polishing of defect (1), using a grinding or polishing disc held on a tool, includes its direction with pressure above defect (1) with orbital, rotational, and/or vibrational movements. The tool is moved above defect (1) automatically and under control of a computer based on the saved program. Grinding or polishing disc (7) is first directed along concentrically inner grinding trajectory (2) relatively to defect (1), and then directed without interruption along spiral grinding trajectory (3) to an outer concentrical grinding trajectory.
EFFECT: speed of grinding of a defect is increased with optimal abrasive consumption.
8 cl, 5 dwg
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