FIELD: electrical engineering.
SUBSTANCE: invention relates to superconductive devices, more specifically invention relates to methods and equipment for protection from failure of superconductivity in such devices and especially in magnets for use in thermonuclear reactors. A device for protection from failure of superconductivity of HTSC circuit contains a circuit of a high-temperature superconductor (hereinafter – HTSC), wherein HTSC circuit contains: a section capable of failure of superconductivity, containing HTSC material and connected in series to other elements of HTSC circuit, while HTSC material contains a stack of HTSC tapes, containing at least one HTSC tape. The device additionally contains: a system of superconductivity failure, made with the possibility of failure of superconductivity of HTSC material in the section capable of failure of superconductivity; a system for protection from failure of superconductivity, made with the possibility of detection of an increase in a temperature in HTSC circuit and, in response to detection of an increase in the temperature, force of the system of superconductivity failure to fail superconductivity of superconductive material in the section capable of failure of superconductivity to discharge accumulated magnetic energy from HTSC circuit to the section capable of failure of superconductivity. In this case, HTSC circuit is made in such a way that, when used, a magnetic field on the mentioned or each HTSC tape is practically parallel to a-b plane of HTSC tape, and the system of superconductivity failure is made with the possibility of failure of superconductivity of HTSC material by creation of an additional magnetic field along a segment of the mentioned or each HTSC tape within the section capable of failure of superconductivity, so that the additional magnetic field has a component perpendicular to a-b plane of HTSC tape.
EFFECT: invention provides a possibility of faster causing intended failure of superconductivity in a superconductive circuit.
15 cl, 6 dwg
Authors
Dates
2022-11-24—Published
2019-01-30—Filed