FIELD: semiconductor devices.
SUBSTANCE: computing system contains: a case, inside which pressure lower than atmospheric pressure outside the case is maintained, the first substrate, as well as the second substrate and a heat shield made with the possibility of thermal separation of the first end from the second end of the first substrate and thermal separation of the third end from the fourth end of the second substrate, so that each of the first set of components is made with the possibility of operation at the first temperature, and each of the second set of components is made with the possibility of operation at the second temperature exceeding the first temperature, while the first temperature is in the range from 2 degrees Kelvin to 77 degrees Kelvin, and the second temperature is in the range from 200 degrees Kelvin to 400 degrees Kelvin.
EFFECT: reduction in thermal conductivity and increase in the efficiency of operation of a computing system.
20 cl, 8 dwg
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