FIELD: composite materials.
SUBSTANCE: invention can be used in the manufacture of substrates for printed circuit boards and dielectric materials. A method for the production of dielectric composite material includes grinding of thermoplastic polymer to an average particle size, mixing of polymer with microspheres, loading of the mixture to a mold, and subsequent induction pressing. Microspheres are made of material including silicon dioxide, sodium oxide, boron oxide, and calcium oxide, and are treated with gamma-aminopropyltriethoxysilane. Thermoplastic polymer may be selected from polyolefins, polycarbonates, fluoroplastics, polyphenylenoxides, or polysulfons.
EFFECT: increase in strength and heat resistance of dielectric composite material.
2 cl, 1 tbl, 4 ex
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