FIELD: mechanics.
SUBSTANCE: grinding devices used in the processing of surface defects. The device consists of a support element (3) and preferably a flexible grinding device (5) held on it. The grinding device has a carrier adjacent to the support element (3). The grinding layer is designed so that, in the grinding position, the grinding device (5) is held on the support element (3) by means of frictional engagement over the entire surface. The friction factor of the support element/grinding device pair is 0.2-0.5.
EFFECT: reduction of the complexity of manufacturing a grinding device.
6 cl, 1 dwg
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