RADIATOR WITH EFFICIENT AND DISTRIBUTED HEAT REMOVAL Russian patent published in 2023 - IPC H05K7/20 

FIELD: heat engineering.

SUBSTANCE: invention can be used for cooling heat-loaded elements of electronic components, power and switching devices, transistor modules, electrical appliances. The technical result is achieved by the radiator made of a heat-conducting material, which contains a heat-absorbing surface in contact with the heat-generating surface of the electronic component, and a heat-distributing surface formed perpendicular to the heat-absorbing surface by parallel ribs that create channels for the passage of the cooling medium. Each rib has holes at the base for the passage of the cooling medium, which are located coaxially and have a different cross section.

EFFECT: increased heat transfer from the radiator to the cooling medium due to the destruction of the boundary layer of the flow of the cooling medium and provision of a given distribution of the temperature field of the heat-absorbing surface.

2 cl, 2 dwg