RADIATOR WITH GROUPS OF THIN FINS Russian patent published in 2023 - IPC G12B15/04 G12B15/06 H05K7/20 

FIELD: heat engineering.

SUBSTANCE: invention can be used for cooling heat-loaded elements of electronic components, complex structures with a series of such components, power and switching devices, transistor modules, electrical appliances. A radiator made of a heat-conducting material contains a heat-absorbing surface in contact with the heat-generating surface of an electronic component or a series of components, and a heat-distributing surface. The heat-distributing surface represents a zone or many individual zones in a complex multi-component design with thin parallel ribs that are perpendicular to the heat-absorbing surface of the radiator and are made in the form of a corrugated tape. The interfin spaces form longitudinal narrow channels for the passage of the cooling medium. The cooling medium enters and exits the interfin spaces through openings in the chambers at the inlets and outlets in spaces occupied by the fins. The supply and removal of the cooling medium is carried out through common external channels to each cooling zone of an individual component, which allows to regulate the cooling medium supply and heat removal in each zone. The holes are located coaxially in all fins and together they form channels through which the cooling medium enters the interfin spaces. The cooling medium is pumped one way into these channels. Depending on the area of the heat-absorbing surface, the holes in the inlet and outlet channels can be made of different sizes.

EFFECT: simplification of the design of a radiator with increased heat transfer from the radiator to the cooling medium and equalization of the temperature of the heat-producing components due to the use of very thin fins and narrow channels between them, the location of a separate group of fins in the zone of a specific component and the supply and removal of the cooling medium separately to each zone of the individual component.

1 cl, 5 dwg