FIELD: acoustics; in particular headphones.
SUBSTANCE: earphone includes an ear-mount structure configured to mount the earphone near a user's ear without obstructing the user's external auditory canal, and comprising a hook-shaped component and a body portion, wherein when the user wears the earphone, the hook-shaped component is hung between the first side ear and the user's head, and the body portion contacts the second side of the ear, the first ear side being the back side of the user's ear, and the second ear side being the outer side of the user's ear; a first group of microphones located in the housing part and configured to receive ambient noise; a processor located in the housing portion and configured to: estimate the sound field at a target spatial position using a first group of microphones, wherein the target spatial position is closer to the user's external auditory canal than any microphone from the first group of microphones, and generate a noise reduction signal based on resulting from the evaluation of the sound field at the target spatial position; and a speaker located in the housing portion and configured to output a target signal corresponding to the noise reduction signal, wherein the target signal is transmitted outside the earphone through an audio output hole to reduce ambient noise, wherein the housing portion includes a connecting component and a fastening component, wherein when the user wears the earphone, the fastening component contacts the second side of the ear, and the connecting component connects the hook-shaped component and the fastening component, wherein a pressure relief hole is provided on the side of the fastening component along the vertical axis direction and near the top of the user's head, and the pressure relief hole is located further from the user's external auditory canal than the sound outlet.
EFFECT: implementation of noise reduction in headphones that do not block the ear canal and an improvement in the listening experience.
9 cl, 19 dwg
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Authors
Dates
2023-11-08—Published
2021-11-19—Filed