FIELD: electroplating.
SUBSTANCE: invention relates to the field of electroplating and can be used in mechanical engineering and electronic industry. The electrolyte contains, g/l: CuSO4⋅5H2O 190-200; H2SO4 50-70; nitroso-p-salt (NRS) 0.2-0.25; water - the rest.
EFFECT: obtaining high-quality copper plating with improved physical and chemical characteristics.
1 cl, 2 dwg
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