ELECTROLYTE FOR COPPER PLATING OF ANODIZED ALUMINUM AND ITS ALLOYS Russian patent published in 2022 - IPC C25D3/38 

Abstract RU 2784143 C1

FIELD: electroplating.

SUBSTANCE: invention relates to the field of electroplating and can be used in mechanical engineering and electronic industry. The electrolyte contains, g/l: CuSO4⋅5H2O 190-200; H2SO4 50-70; nitroso-p-salt (NRS) 0.2-0.25; water - the rest.

EFFECT: obtaining high-quality copper plating with improved physical and chemical characteristics.

1 cl, 2 dwg

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RU 2 784 143 C1

Authors

Deviatkina Tatiana Igorevna

Isaev Valerii Vasilevich

Rogozhin Viacheslav Viacheslavovich

Taranets Roman Vladimirovich

Ivashkin Evgenii Gennadevich

Dates

2022-11-23Published

2022-04-29Filed