FIELD: chemistry.
SUBSTANCE: invention relates to the technology of manufacturing printed circuit boards, in particular to an aqueous composition for cleaning holes of printed circuit boards after permanganate etching, containing 15–25 g/l of hydroxylamine sulphate, 10–25 g/l of oxalic acid, 55–65 g/l of sulfuric acid and 5–10 g/l of oxyethylidene diphosphonic acid. Service life of the composition is increased due to the combined introduction of chelating compounds of oxyethylidene diphosphonic acid (OEDP) and oxalic acid. After treatment of the test sample in the composition of said composition, the quality of the chemical copper coating corresponds to score of 10 by the starry sky pattern.
EFFECT: use of the present invention increases service life of the composition by adding a mixture of oxyethylidene diphosphonic and oxalic acids as chelating compounds.
1 cl, 12 ex
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