SILVER-CONTAINING PASTE FOR FORMING CURRENT HEATING THREADS OF AUTOMOTIVE GLASS AND CONTACT PADS FOR CONNECTING CONNECTORS Russian patent published in 2024 - IPC H01B1/22 H05K1/09 B60J1/20 

FIELD: microelectronics.

SUBSTANCE: invention relates to thick-film microelectronics and concerns silver-containing paste for formation of current heating threads of automotive glass and contact pads for connection of connectors. Paste contains a conductive filler, a structure-forming component and an organic component. Silver powder in concentration of 50–92 wt.% is used as conductive filler, structure-forming component used is glass powder in amount of 1–6 wt.%, is used to optimize annealing conditions of silver powder and promotes good sintering with glass and enamel material. Organic component is used in the paste in amount of 2–49 wt.% as an additive which improves printing properties. Such properties of the paste as sintering capacity, porosity after annealing, and as a result, the value of specific electrical resistance ρ after heat treatment, are determined first of all by characteristics of silver powder in composition of metallization paste.

EFFECT: powder particle size optimization, powder particle shape optimization, mixing of silver powder particles of different shape and size in a certain proportion, surface treatment of powder enable to reduce specific electrical resistance of layer by 30%.

2 cl, 6 dwg, 8 ex