FIELD: microelectronics.
SUBSTANCE: invention relates to thick-film microelectronics. Aluminum paste for making back contact of silicon solar cells with rear dielectric passivation includes aluminum powder, organic binder, glass powder, wherein the paste additionally contains one or a mixture of organometallic compounds of alkali-earth metals, with the following ratio of components, wt. %: powder of aluminum – 68–83; glass powder – not more than 1.0; organometallic compounds of alkali-earth metals – 0.1–2.0; organic binder – 15–35.
EFFECT: invention provides reduced damage to dielectric passivation by paste during burning of contact system of solar cell with simultaneous improvement of quality of rear aluminum contact and quality of passivation in local contacts due to obtaining homogeneous local BSF layer, considerable reduction of defectiveness and increase in efficiency of the solar cell at weight of an impression of aluminum paste of less than 0,7 g per one solar cell.
5 cl, 4 dwg, 2 tbl, 12 ex
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Authors
Dates
2019-05-30—Published
2018-11-08—Filed