FIELD: electronics.
SUBSTANCE: invention relates to electronics and, in particular, to microwave engineering. When producing microstrip band-pass microwave filters, metal strips on the surface of the dielectric base are formed by applying a resistive paste on the surface of the dielectric substrate and firing a layer, wherein the paste includes metal powders with particle size of 20 microns to 100 nanometres, which are deposited on the surface of the substrate at ultrasonic exposure at frequency of 10-15 MHz, followed by firing at temperature of 780-800 °C.
EFFECT: providing high electric strength of the band-pass filter, possibility of expanding the operating bandwidth.
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Authors
Dates
2024-10-14—Published
2023-12-25—Filed