FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of electrical engineering, namely to a method for producing thick-film resistors; it can be used in the production of permanent resistors for hybrid integrated circuits. Burning of high-temperature resistive paste is carried out at a temperature of 650-700°C when exposed to ultrasound with a frequency of 60-65 kHz and an amplitude of 1-1.2 mcm for 15±3 minutes, and then at a temperature of 840-850°C for 15±3 minutes when exposed to an electromagnetic field with a frequency of 60-65 MHz.
EFFECT: increase in the thermal coefficient of resistance by improving the uniformity of formed resistive layers.
1 cl, 1 tbl, 1 ex
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|---|---|---|---|
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| METHOD FOR MAKING THICK-FILM RESISTIVE ELEMENTS | 2012 | 
 | RU2497217C1 | 
| METHOD FOR MANUFACTURING OF THICK-FILM RESISTORS | 1994 | 
 | RU2086027C1 | 
Authors
Dates
2022-04-25—Published
2021-12-17—Filed