METHOD FOR PRODUCING THICK-FILM RESISTORS Russian patent published in 2021 - IPC H01C17/00 H01C17/20 

FIELD: electronic equipment.

SUBSTANCE: invention relates to electronic equipment, namely to production of fixed resistors, including those included in hybrid integrated circuits, and can be used in the electronic, radio engineering and other adjacent branches of industry. In the proposed method, planar contacts are formed on an insulating ceramic substrate in the form of a plate by applying conductor paste by the screen printing method onto the front surface of the substrate. The resistive layer is formed by applying high-temperature resistive paste by the screen printing method followed by firing with ultrasonic impact on the molten paste, wherein annealing is executed with ultrasonic impact at a frequency of 85 to 100 kHz and an amplitude of 0.1 to 0.5 mcm.

EFFECT: increase in the thermal coefficient of resistance due to the improvement in the homogeneity of the formed resistive layers and increase in the yield due to the reduction in the number of production operations and the increase in the controllability of the process of forming layers with high compliance with the preset parameters is the technical result of the invention.

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