FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic engineering and specifically to production of thermistors, and can be used in electronic, radio engineering and other related industries. Method of making thermistors involves forming planar contacts on an insulating substrate by applying a conductive paste by screen printing, forming a resistive layer by applying a high-temperature resistive paste by screen printing, followed by burning-in. Conducting paste application is carried out under action of electromagnetic oscillations with frequency from 1 to 1.5 MHz and amplitude from 0.1 to 0.2 mV with further burning-in at temperature from 790 to 860 °C, and the resistive layer burning-in is carried out under the influence of pulse current with frequency of 250 kHz to 300 kHz with a pulse amplitude of 10 to 20 mV at temperature of 840 to 860 °C.
EFFECT: reduced spread of resistance of thermistors, increased yield ratio and reduced prime cost.
1 cl
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR PRODUCING THICK-FILM RESISTORS | 2021 |
|
RU2770906C1 |
METHOD FOR PRODUCING THICK-FILM RESISTORS | 2021 |
|
RU2770908C1 |
METHOD FOR OBTAINING THICK-FILM RESISTORS | 2021 |
|
RU2776657C1 |
METHOD FOR PRODUCING THICK-FILM RESISTORS | 2020 |
|
RU2755943C1 |
METHOD OF PRODUCING MICROSTRIP BAND-PASS MICROWAVE FILTERS | 2023 |
|
RU2828479C1 |
THICK-FILM RESISTOR FABRICATION METHOD | 2014 |
|
RU2552626C1 |
THICK-FILM RESISTOR FABRICATION METHOD | 2014 |
|
RU2552631C1 |
METHOD FOR OBTAINING THICK-FILM STRUCTURES FOR THERMAL POWER GENERATORS | 2020 |
|
RU2755344C1 |
METHOD FOR MAKING THICK-FILM RESISTIVE ELEMENTS | 2012 |
|
RU2497217C1 |
METHOD FOR MANUFACTURING OF THICK-FILM RESISTORS | 1994 |
|
RU2086027C1 |
Authors
Dates
2025-05-05—Published
2024-12-16—Filed