ADAPTER FOR FITTING MICROPROCESSOR INTO SEMI-METALLIC CARD Russian patent published in 2025 - IPC G06K19/00 

FIELD: physics.

SUBSTANCE: invention relates to production of payment and identification cards having metal layers in the structure and intended for contactless payment or identification. Claimed technical result is provided due to the design of the adapter device for the microprocessor installation into the semi-metallic card, which is a multilayer printed circuit board with a hole for the microprocessor chip placement, multilayer printed circuit board includes at least two layers of foil material bonded to each other with an adhesive composite composition, and contacts located on the surface of the adapter, facing the front side of the card when installed in the housing of the card, and intended for connection to the contacts of the microprocessor, wherein on each layer of multilayer printed circuit there are turns of electric coil connected to each other and to contacts by means of metallized coating on walls of holes in layers of multilayer printed circuit board.

EFFECT: automation of the process of implantation of microprocessors and enabling use of microprocessors without inductive technology for implementation of a contactless interface.

3 cl, 6 dwg