FIELD: electrical engineering, radio electronics. SUBSTANCE: powdery composition including, parts by mass: epoxy resin 51.2-59.2; polyarylamine based on toludiene and formaldehyde 3.5-6.8; titanium dioxide 35.0-40.0; polyvinylbutiral being the balance, is deposited by electrostatic spraying on surfaces and into holes of metal base. After fusion of powder at temperature 165-175 C base is pressed together with package of dielectric layers with one-sided or two-sided pattern of multilayer printed circuit board. Pressing is performed for the course of 0.5-1.5 h under pressure 15-20 kgf/sq. cm at fusion temperature. Manufactured multilayer printed circuit board has enhanced thermal conductivity 0.40 W/m.deg and adhesion of coat to metal amounts to 2.5-3.0 kg/sq.cm. EFFECT: improved electrical and mechanical characteristics with simultaneous increase of thermophysical parameters of printed circuit boards. 1 tbl
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