FIELD: mechanical engineering. SUBSTANCE: device has metallic substrate- housing 1 and electrodes 3 and 4 connected to power source 6. The electrodes are insulated from the substrate and each other with a dielectric layer. Parts to be machined are secured to two-layered dielectric covering 9 applied to the substrate. The covering comprises dielectric film coating that is not glued to the substrate and flexible film applied from above to the film coating. When electrodes 3 and 4 are connected to power source 6 parts are secured to the substrate due to electrostatic and intermolecular forces. EFFECT: enhanced reliability. 3 dwg
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Authors
Dates
1996-12-10—Published
1989-02-10—Filed