METHOD FOR ATTACHMENT OF SEMICONDUCTOR PLATES PREDOMINANTLY FOR MECHANICAL MACHINING OF THEIR SURFACE Russian patent published in 1996 - IPC

FIELD: electronics. SUBSTANCE: method is designed for manufacture of semiconductor integrated microcircuits. Increased reliability of attachment of semiconductor plates is achieved by enhanced uniformity of pressure of semiconductor plate against substrate. For placement of semiconductor plates on substrate each plate is positioned coaxially to electrodes so that contour of plate is on surface limited by outer diameter of external electrode. Method excludes multiple heating and cooling., adhesion and cleaning of semiconductor plates, requirement for adhesive compounds and toxic explosion-risky solvents. EFFECT: increased reliability of attachment of semiconductor plates. 2 dwg