FIELD: production of semiconductor structures. SUBSTANCE: gallium arsenide substrates heated up to 540-640 C at pressure of 1-5 mm Hg is subjected to polishing etching in the medium of hydrogen plasma of HF-glow discharge with addition of arsine, them, layers of metalloorganic compounds are grown by hydride method. EFFECT: reduced etching selectivity and simplified etching process.
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Authors
Dates
1995-06-19—Published
1990-05-16—Filed