FIELD: radioelectronic engineering. SUBSTANCE: case has cover and sealed heat-transfer base joined together so that space is formed between them; case base is multilayer printed-circuit board carrying conductors and screens on insulated layers made as unequal-size frames with ports and open contact pads arranged on outer perimeters of frames to form stepwise groups of contact pads on outer perimeter. Case interior is truncated pyramid whose side faces carry multilayer printed structures. Case is provided with matching components. Multilayer printed-circuit structures connect through their elementary conductors end contacts of pyramid conductors with open contact pads located in inner perimeter of bottom layer of base. Matching components are built in base conductors or in elementary conductors of printed-circuit structures. Matching components may be made, for example, in the form of matching impedance transformers, delay lines, etc. EFFECT: extended band of frequencies passed by case. 3 cl, 5 dwg
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Authors
Dates
1996-11-20—Published
1990-11-06—Filed