STRONG MULTILAYER PRINTED BOARD, CONTAINING LOW-CUTTING CONTROL CIRCUITS Russian patent published in 2017 - IPC H05K3/46 

FIELD: radio engineering, communication.

SUBSTANCE: multi-layer printed circuit board contains layers including layers of high-current circuits, layers of low-current circuits, and screen layers. To improve the manufacturing process of a multi-layer printed circuit board on high-current layers of the board, regions that are free of high-current circuits must be filled with metallised areas electrically connected to the shield layers of the board to ensure its interference immunity. In this case, on the board in the field of contact pads of mounting holes associated with high-current layers, there are through-through metallised holes that perform the function of a thermal gate to ensure soldering of electrical installation elements.

EFFECT: providing the required current load up to 20 A for high-current conducting layers of a multi-layer printed circuit board, uniform heat removal from the board heating area, creation of improved soldering conditions for wiring elements.

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