MULTICHIP MODULE Russian patent published in 1997 - IPC

FIELD: radio electronic and digital commuting engineering; microelectronic design, including development of semiconductor substrate base multichip modules. SUBSTANCE: multichip module has substrate 1 made of semiconductor material, such as silicon, carrying on its surface internal and external contact pads 2 and 3 interconnected through metallized conductors placed on respective metallized layers, chips of integrated circuits 9 whose leads 5 are connected to respective internal contact pads 2, base, cover 6, and external leads 7. Semiconductor substrate 1 and base are built integral; semiconductor structures are made in module substrate; module cover 6 is mounted directly on substrate 1; external leads are connected to external contact pads 3 of substrate and arranged on external side of cover 6; substrate 1 is provided with stiffening plate 9 and heat sink 11 ; for assembling module parts, use is made of polymeric adhesive materials having coordinated temperatures of linear thermal expansion. EFFECT: improved speed, integration level, reliability; extended operating temperature range. 10 cl, 4 dwg