SEMICONDUCTOR DEVICE HEAT SINK Russian patent published in 1994 - IPC

Abstract RU 2012098 C1

FIELD: electronic engineering. SUBSTANCE: semiconductor heat sink has cooler with rectangular fins and members being cooled. Fan is fully immersed in cooler case and mounted in cylindrical recesses; size of one of recesses corresponds to that of fan impeller blades, that of other recess, to size of fan portion protruding beyond blades; fan is attached to pair of thick cooler fins. EFFECT: reduced mass and size of heat sink. 2 cl, 3 dwg

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RU 2 012 098 C1

Authors

Miroshnichenko L.N.

Evstaf'Ev A.S.

Zhuravskaja I.N.

Pusev A.N.

Turty M.V.

Dates

1994-04-30—Published

1990-07-27—Filed