SEMICONDUCTOR DEVICE COOLING ARRANGEMENT Russian patent published in 1999 - IPC

Abstract RU 2133561 C1

FIELD: electrical engineering; power supplies with force-cooled semiconductor devices. SUBSTANCE: cooling arrangement has cooler with fins forming ducts for passing cooling air stream forced by fan. The latter is attached to cooler through sealed joint at distance depending on impeller design. Cross-sectional area of cooler internal ducts and flow section of fan are interrelated through specified dependence. Cooling air flow is swirled to augment cooling of semiconductor devices mounted on cooler surface by means of dissectors provided for the purpose. EFFECT: improved cooling efficiency and reliability of cooling arrangement. 5 cl, 2 dwg

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RU 2 133 561 C1

Authors

Mironov A.V.

Vapnichnyj V.I.

Dates

1999-07-20—Published

1998-03-27—Filed