FIELD: electronics. SUBSTANCE: sections K with wire leads are soldered to output frame composed of cathode flat lead and flat outer anode lead. End of flat outer anode lead is divided into three parts. Cathode lead of section is soldered to flat cathode lead and wire anode lead is welded to center part of flat outer anode lead. Safety element from fusible metal is set between center part of flat outer anode lead and extreme part. EFFECT: simplified design and miniaturization of structure. 5 dwg
Title | Year | Author | Number |
---|---|---|---|
PROCESS OF MANUFACTURE AND TEST OF ELECTRON COMPONENTS | 1997 |
|
RU2133522C1 |
PROCESS OF ENCAPSULATION OF MICROCIRCUITS BY PRESS-COMPOUND | 1987 |
|
SU1498324A1 |
METHOD FOR ENCAPSULATION OF ELECTRONIC COMPONENTS | 2012 |
|
RU2503086C1 |
METHOD FOR THREE-DIMENSIONAL MULTI-CHIP PACKAGING OF INTEGRATED MEMORY MICROCIRCUITS | 2019 |
|
RU2705229C1 |
OXIDE-SEMICONDUCTOR CAPACITOR | 0 |
|
SU1824654A1 |
SINGLE-CRYSTAL MODULE FOR INTEGRATED CIRCUIT | 1998 |
|
RU2134465C1 |
METHOD OF MAKING SEMICONDUCTOR DEVICES | 2012 |
|
RU2511054C2 |
0 |
|
SU387448A1 | |
PACKAGING OF PHOTONIC CRYSTALLINE SENSORS INTENDED FOR EXTREME CONDITIONS | 2013 |
|
RU2633675C2 |
HEAVY-LOAD-CURRENT SEMICONDUCTOR DEVICE PACKAGE | 2006 |
|
RU2322729C1 |
Authors
Dates
1994-05-30—Published
1991-07-24—Filed