PACKAGING OF PHOTONIC CRYSTALLINE SENSORS INTENDED FOR EXTREME CONDITIONS Russian patent published in 2017 - IPC G02B6/42 G02B6/24 G01D11/24 G01L9/00 

FIELD: physics.

SUBSTANCE: metallization of the sensor chip is performed on the toroidal pattern. Herewith the toroidal pattern corresponds to the diameter and thickness of the kovar tube walls. The center of the sensor chip is combined with the central axis of the kovar tube end face. The sensor chip is soldered to the kovar tube end face to form the sensor chip assembly. The fiber metallization is carried out. The metal sleeve is assembled with the metallized fiber by soldering the metallized fiber inside the metal sleeve. The metal sleeve is introduced inside the kovar tube of the sensor chip assembly. The end of the metallized fiber is combined with the sensor chip of the sensor chip assembly. The outer surface of the metal sleeve is soldered to the inner kovar tube surface of the sensor chip assembly.

EFFECT: ability to operate under adverse environmental conditions.

34 cl, 5 dwg