EPOXY COMPOSITION Russian patent published in 1994 - IPC

FIELD: production of semiconductor devices. SUBSTANCE: hardener on the base of imidazoline derivatives is mixed with N-methylpyrrolidone and sustained within 2 h by heating from 50 C to 100 C. Epoxy resin is added after cooling then mixture is mixed within 2 h and evacuated at pressure 10^-3 torr at room temperature. This prepared composition is applied on surfaces to glue them together, hardening time at room temperature and at 60 C is 1 day and 15 h respectively. Proposed composition contains epoxy resin (100 mass parts), hardener (40-65 mass parts) and N-methylpyrrolidone (10-35 mass parts). EFFECT: improves quality of desired composition. 1 tbl