FIELD: glue materials.
SUBSTANCE: invention relates to a method for preparing glue epoxide composition based on modified epoxy resin with a hardening agent of amine type. The composition comprises the following ratio of components, mas. p. p.: modified epoxy resin, 90-110, and hardening agent, 60-75. As modified epoxy resin epoxy organosilicon resin in furylglycidyl ester - SEDM-3P is used, and adduct of butyl methacrylate with diethylenetriamine - DTB-2 is used as a hardening agent. Invention provides the development of the composition showing stability against multiple impacts and to enhance heat-transferring capacity in the range of cryogenic temperatures. Proposed composition can work at cryogenic temperature and can be used in making optical-electronic devices, among them, cooled photodetectors under conditions of multiple thermal impacts.
EFFECT: improved and valuable properties of composition.
2 tbl, 6 ex
Title | Year | Author | Number |
---|---|---|---|
ADHESIVE EPOXIDE COMPOUND | 2011 |
|
RU2457231C1 |
ELECTROCONDUCTIVE ADHESIVE | 2011 |
|
RU2466168C1 |
HEAT RESISTANT ADHESIVE COMPOSITION | 1992 |
|
RU2061727C1 |
HEAT-RESISTANT ADHESIVE COMPOSITION | 2003 |
|
RU2238294C1 |
EPOXIDE GLUE COMPOSITION | 2007 |
|
RU2368636C2 |
GLUE COMPOSITION FOR TENSORESISTOR GLUEING | 1990 |
|
RU1818832C |
HEAT RESISTANT GLUE COMPOSITION OF COLD HARDENING | 2007 |
|
RU2368635C2 |
HEAT-STABLE GLUE COMPOSITION | 1991 |
|
RU2021314C1 |
THERMAL CONDUCTING DIELECTRIC COMPOUND | 2017 |
|
RU2650818C1 |
OPTICAL ADHESIVE | 1998 |
|
RU2141989C1 |
Authors
Dates
2006-02-10—Published
2004-09-09—Filed