FIELD: construction.
SUBSTANCE: compound contains oligodieneurethane epoxide, isomethyl tetrahydrophthalic anhydride. The compound additionally contains a monoglycidyl ether of butyl cellosolve and a hexagonal boron nitride. To produce the compound, the pre-heated oligodieneurethane epoxide, monoglycidyl ether of butyl cellosolve and hexagonal boron nitride are mixed. Then the isomethyl hydrophthalic anhydride is added into the produced mixture and hardened.
EFFECT: compound has lower temperature of hardening and has lower specific volume resistance after durable impact of high moisture and resistance to a compression stroke.
2 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
COMPOUND FOR SEALING RADIOELECTRIC COMPONENTS AND METHOD OF OBTAINING COMPOUND FOR SEALING RADIOELECTRIC COMPONENTS | 2013 |
|
RU2532556C2 |
COMPOUND FOR SEALING ELECTRO-RADIOTECHNICAL ARTICLES AND METHOD OF PRODUCING SAID COMPOUND | 2010 |
|
RU2439117C1 |
COLD SETTING COMPOUND | 2012 |
|
RU2481373C1 |
MULTILAYER SELF-ADHESIVE MATERIAL | 2016 |
|
RU2628786C1 |
COMPOUND AND A METHOD FOR PREPARATION THEREOF | 2005 |
|
RU2291176C1 |
MANUFACTURING METHOD OF PARTS FOR HOUSINGS OF SMALL-SIZED PHASE SHIFTERS FROM FOIL | 2013 |
|
RU2551342C1 |
COMPOSITION FOR HEAT-CONDUCTING GLUE FORMULATION | 2004 |
|
RU2276169C1 |
COMPOUND AND A METHOD OF ITS MAKING | 0 |
|
SU1838361A3 |
ELECTRICAL INSULATING PILLING AND IMPREGNATION COMPOUND | 2022 |
|
RU2787124C1 |
ELECTRIC INSULATING FILLING-IMPREGNATING COMPOUND | 2017 |
|
RU2672094C1 |
Authors
Dates
2013-02-10—Published
2011-03-09—Filed