HEAT-STABLE GLUE COMPOSITION Russian patent published in 1994 - IPC

FIELD: glueing materials. SUBSTANCE: composition has, mas. p.: epoxyorganosilicon resin - product of epoxy-diane resin modification with organosilicon compounds 100; isomethyltetrahydrophthalic anhydride 30-45; epoxyvinyl ester of formula CH₂=CHO-CH₂-CH₂-CH₂-CH₂-OCH₂-CH-CH₂O 5-25, and tris-2,4,6-(dimethylaminomethyl)-phenol 0.8-1.5. Composition is mixed and hardened at 200 C for 3 h. Glue properties: strength at break off of silicate glass glue joints at 20 C is 232kg/cm², at 250 C is 33kgs/cm², after thermal ageing at 250 C for 100 h is 28kgs/cm², light transparency at 20 C is 97%, decrease of integral transparency after thermal ageing at 250 C for 100 h is 0.5%. EFFECT: enhanced quality of glue composition. 1 tbl