FIELD: electronic engineering. SUBSTANCE: process involves setting of high-frequency gaps and load of cavities by depositing material absorbing high-frequency energy, such as Alsifer, on surfaces. In manufacturing cavity unit, single drift tube is inserted throughout its entire length and soldered to cavity-to-cavity jumpers, then high-frequency gaps are cut in specified points of tube by electric-arc processing. EFFECT: simplified procedure, improved quality and reliability of klystrons. 7 dwg
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Authors
Dates
1994-11-30—Published
1991-07-09—Filed