METHOD OF MEASUREMENT OF THICKNESS OF LAYERS IN PROCESS OF THEIR DEPOSITION ON HEATED SUBSTRATE Russian patent published in 1994 - IPC

FIELD: electronics. SUBSTANCE: for increased precision of determination of layer thickness of rotating substrate registration of time dependence of intensity of inherent heat radiation of formed structure at wave lengths λ₁,λ₂,λ₃ chosen for defined conditions is conducted, number of half-periods of time dependence of intensity of heat radiation for λ₂ is found by relation between intensities of this radiation on wave lengths λ₁ and λ₃ and thickness layer is calculated by formula. EFFECT: increased precision of determination of thickness of layer. 2 cl, 2 dwg, 2 tbl