FIELD: instruments. SUBSTANCE: method involves application of current conducting cover on surfaces of metal elements which are connected to piezoelectric elements while they are affected with ultrasound waves. This is made from Gallium-tin alloy having 90 percents of Gallium and 10 percents of tin. Then these elements are heated to approximately 120 C in open air. This temperature is applied for 24 hours. Later on elements are cooled. Then contacting surfaces of piezoelectric element and metal elements are tin-coated by composite diffusion- hardened solder which is made with Gallium while ultrasound waves are applied. This solder has 32-34 percents of Gallium-tin alloy (90 percents of Gallium and 10 percents of tin), 68-66 percents of powder of copper-tin alloy (95 percents of copper and 5 percents of tin). After this, contact plates of wither piezoelectric element or metal elements is covered by layer of the same composite diffusion-hardened solder. Depth of layer is less than 0,15 mm. Surfaces of piezoelectric element and metal elements are faired to each other, pressed with force (1,5-2,5)·10 H/m2 and kept at temperature 70-100 C for 48-72 hours. After this, product is cooled down to room temperature. EFFECT: increased functional capabilities. 3 cl
Title | Year | Author | Number |
---|---|---|---|
PROCESS OF BRAZING OF PARTS WITH DIFFUSION-SOLIDIFYING SOLDER | 1992 |
|
RU2053063C1 |
SOLDER FOR FLUX-FREE SOLDERING AND METHOD FOR ITS MANUFACTURE | 2015 |
|
RU2609583C2 |
DIFFUSION-HARDENING SOLDER | 2010 |
|
RU2438844C1 |
0 |
|
SU550259A1 | |
FLUX-FREE SOLDER | 2012 |
|
RU2498889C1 |
SOLDER FOR FLUXLESS SOLDERING | 2006 |
|
RU2317882C1 |
CERAMIC MATERIAL SOLDERING METHOD | 1992 |
|
RU2030977C1 |
SOLDER FOR FLUXLESS SOLDERING | 1992 |
|
RU2012468C1 |
0 |
|
SU550258A1 | |
SOLDER FOR FLUXLESS SOLDERING | 2010 |
|
RU2432242C1 |
Authors
Dates
1995-05-27—Published
1992-07-07—Filed