DIFFUSION-HARDENING SOLDER Russian patent published in 2012 - IPC B23K35/24 

FIELD: chemistry.

SUBSTANCE: invention relates to diffusion-hardening solder compositions which can be used to obtain permanent joints between materials of different types. The invention discloses a diffusion-hardening solder in form of a paste for obtaining permanent joints between materials of different types. The solder contains a gallium-indium-tin alloy and filler. The filler is copper divanadate and components are in the following ratio in wt %: gallium-indium-tin alloy 48-52, copper divanadate 52-48. The gallium-indium-tin alloy has the following composition, in wt %: gallium 70, indium 22.5, tin 7.5.

EFFECT: solder has negative, zero or close to zero volumetric coefficient of thermal expansion, which enables to avoid problems associated with mismatch of volumetric coefficient of thermal expansion of the materials being joined.

2 cl, 5 ex