SOLDER FOR FLUXLESS SOLDERING Russian patent published in 1994 - IPC

Abstract RU 2012468 C1

FIELD: soldering. SUBSTANCE: solder contains the following components (in % by mass): indium 21.2-28.5; bismuth 12.0-15.6; tin 7.0= 9.5; cadmium 1.9-3.8; nickel 8.0-18.3; carbon 0.9-2.3; boron 1.3- 2.0; silicon 0.3-1.1; copper 31.6-60.4. EFFECT: increased quality of soldering. 2 tbl

Similar patents RU2012468C1

Title	Year	Author	Number
CERAMIC MATERIAL SOLDERING METHOD	1992	Skachkova L.M. Mozhajkin Eh.Z. Klishin N.I.	RU2030977C1
ALLOY SOLDER FOR SOLDERING STAINLESS STEELS AND NICKEL-BASED ALLOYS	1993	Belozerov V.Ja. Kejlin V.I. Starodubtsev Ju.N.	RU2096150C1
SOLDER FOR SOLDERING MAINLY COPPER AND COPPER-BASED ALLOYS	1993	Starodubtsev Ju.N. Kejlin V.I. Belozerov V.Ja.	RU2041783C1
SOLDER FOR LOW-TEMPERATURE SOLDERING	2002	Prishvin D.S. Shishkina Z.I. Pavlov B.A. Shcherbakov N.V.	RU2219030C1
FLUX-FREE SOLDER	2012	Ivanov Nikolaj Nikolaevich Ivin Vladimir Dmitrievich Dzjubanenko Sergej Vladimirovich Luk'Janov Valerij Dmitrievich Fedorov Sergej Sergeevich	RU2498889C1
SOLDER FOR SOLDERING OIL AND GAS FIELD EQUIPMENT	1994	Solov'Ev A.D. Beletskij Ju.I. Kljuk B.A. Saljukov V.V. Vershinin N.I.	RU2070496C1
SOLDER FOR FLUXLESS SOLDERING	2006	Temnykh Vladimir Ivanovich Kazakov Vladimir Sergeevich Zelenkova Elena Gennad'Evna	RU2317882C1
METALLOCERAMIC SOLDER FOR FLUXLESS SOLDERING	1979	Moiseevskij Ju.A. Pekin Ju.I. Sumskaja V.P. Chelyshev V.B. Chulkov E.I. Shtyleva V.D.	SU803280A1
SOLDER	0	Smirnov Vladimir Viktorovich Markov Maksim Evgenevich Silaev Aleksej Efimovich Prokofeva Elena Aleksandrovna	SU1706816A1
SOLDER FOR FLUX-FREE SOLDERING AND METHOD FOR ITS MANUFACTURE	2015	Zefirov Viktor Leonidovich Bakina Lyubov Igorevna Zakharychev Evgenij Aleksandrovich	RU2609583C2

RU 2 012 468 C1

Authors

Skachkova L.M.

Mozhajkin Eh.Z.

Klishin N.I.

Dates

1994-05-15—Published

1992-02-06—Filed