FIELD: electronic technics. SUBSTANCE: packet of inventions focuses on sealing radio elements with special attention to developing epoxide compound for protecting radio elements, chiefly multilayer ceramic condensers against injurious effect of hydrogen in the case when platinum content in inner electrodes of condensers is less than 10% or in complete absence of platinum. This task is solved by using epoxide compound containing (in weight parts): epoxide 4,4'-isopropylidenediphenol resin, 95-100; polyethylenepolyamine (amine hardener), 10-14; cresyl glycidyl ether (diluent), 15-25; mineral fillers including ground mica, 10-13; and pigment, and also, as mineral filler, additionally contains chemically precipitated chalk, 5-7, and, as pigment, titanium dioxide, 1-2. Protection procedure includes installing condensers into nests in a rubber or plastic mold, pouring prepared compound into mold, and its thermal solidification. Not later than in 900 s after compound has been poured in, 9:1 ethanol-acetone mixture is sprayed onto open surface of condensers during 3-5 s. EFFECT: improved protection quality. 2 cl, 1 tbl
Title | Year | Author | Number |
---|---|---|---|
MOISTURE-PROTECTIVE FILLING COMPOUND | 2013 |
|
RU2552742C2 |
WATERPROOFING POURING COMPOUND | 1990 |
|
RU1786819C |
EPOXY POURING COMPOUND | 1992 |
|
RU2036948C1 |
POURING INSULATION COMPOUND | 0 |
|
SU1830074A3 |
POURING COMPOUND | 1992 |
|
RU2039785C1 |
ELECTRICAL EMBEDMENT COMPOUND | 2007 |
|
RU2343577C1 |
CASTING COMPOUND | 2012 |
|
RU2521440C1 |
GLUE COMPOSITION | 2005 |
|
RU2285027C1 |
THIXOTROPIC COMPOUND | 0 |
|
SU1613459A1 |
EPOXY COMPOSITION | 2023 |
|
RU2807757C1 |
Authors
Dates
1997-07-10—Published
1994-04-22—Filed