FIELD: soldering of copper. SUBSTANCE: solder contains, at. nickel, 5-20; tin, 2-10; phosphorus, 10-15; one or more components from the group containing gallium, indium, bismuth, lead, cadmium, zinc, 0.01-0.5; copper, the balance. Solder should preferably be made in the form of a quick-hardened strip whose structure is amorphous at least by 50 EFFECT: improved composition. 2 cl, 1 tbl
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Authors
Dates
1995-08-20—Published
1993-04-08—Filed