METHOD FOR MANUFACTURE OF CERAMIC-METAL COMMUTATION BOARDS Russian patent published in 1995 - IPC

FIELD: electronic equipment. SUBSTANCE: method involves applying continuous layer of metalling paste with the thickness of 20-30 micron onto test high alumina content substrate; sintering at temperature of 1450-1650 C; regulating paste content; applying this paste (No1) onto additional test substrate to form conductor of predetermined width; sintering; controlling shrinkage ratio of conductor and substrate by measuring conductor length in the zone of local defect; comparing it with that of continuous layer of paste (No1) and conducting further regulation of paste content to provide decreasing of shrinkage coefficient for a value equal to difference between shrinkage coefficients of conductor and continuous layer of paste (No1); applying ready paste onto substrate and sintering. EFFECT: increased efficiency and high quality of boards.