FIELD: electronic industry. SUBSTANCE: in claimed method, cermet material boundary is roughened by sedimentative recession of particles of metal coated layer in organic binder which fills up space between hard ceramic particles of surface layer of uncaked ceramic substrate. To this end, metal coated substrate is located in centrifuge, and centrifuge is rotated at rate from 10 to 11000 rpm for time period from 1 to 120 minutes. EFFECT: more efficient method of applying metal coating onto ceramic products. 1 ex, 2 tbl
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