METHOD OF FORMING INTERLAYER JUNCTIONS IN MULTILAYER METAL-CERAMIC BOARD Russian patent published in 2017 - IPC H01L21/77 H05K3/42 

FIELD: physics, instrument-making.

SUBSTANCE: invention relates to production of radioelectronic equipment. The technical result is high reliability of metal-ceramic boards in the region of interlayer junctions, smaller dimensions of the latter and high packing density thereof in the metal-ceramic boards - achieving filling of via-holes by covering walls of via-holes with a layer of a low-viscous metallisation paste with subsequent filling of the holes with metallised walls with a high-viscous metallisation paste, which prevents breakdown of the metal-ceramic board during thermal treatment. A thin annular metallisation interlayer is applied faster than the main metallisation and offers additional compressing action on the side of the ceramic on a densely sintered conductor with a cylindrical shape, thereby reducing structural stress in the ceramic substrate and preserving integrity of the structure. This enables to form via-holes close to each other and thereby increase packing density of interlayer junctions.

EFFECT: invention increases reliability of metal-ceramic boards, reduces the size of inter-layer junctions and increases packing density thereof in metal-ceramic boards.

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