FIELD: electronics. SUBSTANCE: conductor paste is composed of following components, per cent by mass: carbonyl iron 55.0-78.0; carbon black 2.0-25.0; epoxy resin 5.3-6.2; hardener 2.7-3.0; glycerine 1.8-2.0; solvent 9.3-9.5. EFFECT: reduced temperature of formation of conductive layer, provision for high adhesive properties both to copper and to dielectric base. 1 tbl
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Authors
Dates
1995-09-10—Published
1992-05-20—Filed